Case: Fine Copper Mesh Etching
案例：0.1 mm 精细铜网蚀刻
标签：铜网, 精细蚀刻, 电磁屏蔽, 案例
某 EMC 屏蔽铜网（开孔 0.12 mm、丝宽 0.08 mm、板厚 0.05 mm）采用双面感光对位蚀刻：上下膜对位精度 ±10 μm、喷淋蚀刻（压力 0.15 MPa）替代浸泡防侧蚀——侧蚀系数从 1:0.8 降到 1:0.3。关键在抗蚀膜附着力：贴膜前等离子清洗、蚀刻液温度恒定 45±1 ℃。成品网孔均匀性 95% 以上，用于 5G 设备屏蔽罩兼透风散热。蚀刻开孔比冲压在 0.1 mm 级别成本低 60%。
A fine EMC shielding mesh (0.12 mm apertures, 0.08 mm webs, 0.05 mm copper) was made by two-sided aligned photo-etching: registration ±10 μm and spray etching (0.15 MPa) instead of immersion cut the undercut factor from 1:0.8 to 1:0.3. Keys are resist adhesion (plasma cleaning before lamination) and bath control at 45±1 °C.Aperture uniformity reached 95%; at 0.1 mm scales etching is 60% cheaper than stamping—used for 5G shield vents.