Cyanide-Free Alkaline Copper Plating
无氰碱性镀铜
标签：无氰电镀, 碱性镀铜, 络合剂, 预镀, 环保工艺
无氰碱性镀铜液（以碱式碳酸铜供给 Cu²⁺ 15–20 g/L，柠檬酸盐/酒石酸盐络合，pH 9.0–9.5，温度 40–50℃，电流密度 1–3 A/dm²）替代氰化物预镀铜，结合力良好且废水处理简单。入槽前活化（5% 硫酸 + 少量氟化氢铵，30 s）是关键，带电入槽防止生成置换铜层。沉积 5–10 μm 后可转酸性硫酸盐镀铜加厚。
Cyanide-free alkaline copper (Cu²⁺ 15–20 g/L from basic copper carbonate, citrate/tartrate complexant, pH 9.0–9.5, 40–50℃, 1–3 A/dm²) replaces cyanide strike plating with good adhesion and easy wastewater handling. Activate before entry (5% sulfuric acid + a little ammonium bifluoride, 30 s) and enter live to prevent immersion copper. Build 5–10 μm, then thicken in acid sulfate baths. ---