Pulse Plating & Pulsed Electro-Coloring
脉冲电镀铜与脉冲电解着色
标签：脉冲电镀, 占空比, 晶粒细化, 整流器, 着色控制
脉冲整流器（方波，频率 100–1000 Hz、占空比 10–30%、峰值电流密度为直流的 2–4 倍）镀铜可将晶粒细化至 1–5 μm，镀层致密光亮、深孔分散能力显著提升；用于电解着色时，低占空比脉冲抑制析氢与局部烧焦，色带过渡更细腻。调试遵循"先定频率、再调占空比、后定峰值电流"，并配示波器实测挂具末端波形，防止线路感抗导致波形畸变失效。换向脉冲（正反向比 20:1）还可减少毛刺。
Pulse rectifiers (square wave, 100–1000 Hz, 10–30% duty, 2–4× DC peak current density) refine copper grains to 1–5 μm, giving denser, brighter deposits with better throwing power in deep recesses; in electro-coloring, low duty suppresses hydrogen evolution and burning for smoother tonal gradients. Tune frequency first, then duty, then peak current, verifying the waveform at rack ends with an oscilloscope—line inductance can distort it. Reverse pulses (20:1 forward:reverse) further reduce nodules.
